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Hisense · Smartphone · 2018

Hisense H20

Hisense h20: Qualcomm Snapdragon 636 SDM636, 128 GB storage. Released in 2018.

Chipset
Qualcomm Snapdragon 636 SDM636
Storage
128 GB

Camera

rear
12 MP
front
20 MP

Memory

ram
6 GB
storage
128 GB
expandable
microSD/microSDHC/microSDXC

Battery

type
Li-Polymer
capacity
3020 mAh

Display

size
5.84 in
type
IPS
resolution
1080 x 2220 px

Physical

weight
164 g
dimensions
148.59 x 71.22 x 7.98 mm

Software

os
Android

Performance

cpu
4x 1.8 GHz Cortex-A73 + 4x 1.6 GHz Cortex-A53 (Kryo 260)
gpu
Adreno 509
chipset
Qualcomm Snapdragon 636 SDM636

Connectivity

usb
Type-C 2.0

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